Join us for our 17th year! of an information packed three day Symposium about the latest in High Performance Interconnects. IEEE Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from on-chip interconnects to wide-area networks. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field.

Two days of technical sessions led by Keren Bergman, Columbia University our 2009 General Chair and a day of tutorials to keep you on top of the latest industry developments and academic laboratories.

Our objective is to address the Networking and Supercomputing families. This year we are proud to have Ron Brightwell with Sandia National Laboratories and Fabrizio Petrini from IBM TJ Watson and Head Bubba from Credit Suisse as our 2009 IEEE Hot Interconnects Program Co-Chairs.

To date, we have two distinguished keynotes and a third to be announced:
Andrew F. Bach, Senior Vice President, Communications, New York Stock Exchange and Anant Agarwal, professor at MIT and founder and CTO, Tilera.

As you know, these are interesting times for Wall Street. They will certainly prove to be interesting for this 17th Annual Hot Interconnects Conference this August. We hope you can join us as we present in the heart of this historically interesting time where you can benefit not only by the content, but also by the networking opportunity this event can potentially offer.