Welcome to the 32nd iteration of the IEEE Hot Interconnects symposium.
HotI’2025 will be held virtually.
2025 Conference Theme
Interconnect Software: You can't touch it but you need it
The latest advancements in photonics, chips, parallel paths, and other cutting-edge interconnect technologies are dazzling. However, the picture is incomplete without the system software needed to exploit their full potential. This edition of Hot Interconnects will explore the underlying software ecosystems that empower interconnect fabrics to support a wide array of applications.
2025 Conference Theme
Interconnect Software: You can't touch it but you need it
Call for Papers [details]
| Event | Date |
|---|---|
| Paper abstract deadline | |
| Submission deadline | |
| Notification of acceptance | June 27, 2025 |
| Camera-ready due | July 18, 2025 |
Call for Tutorials [details]
| Event | Date |
|---|---|
| Proposals due | June 3, 2025 |
| Notification of acceptance | June 10, 2025 |
| Materials due | August 2, 2025 |
HotI32 (2025) Overview
IEEE Hot Interconnects is the premier international forum for researchers and developers of state of the art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field.
Our objective is to address the data center networking and the supercomputing communities. We hope you can join us and benefit not only by the content but also by the prime networking opportunities this event always offers.
Keynotes
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| Amin Vahdat | Deepak Bansal |
| Vice President of ML, Systems, and Cloud AI at Google | Vice President and Technical Fellow in Azure Core Engineering at Microsoft |
|
Title TBA [details] |
Evolving inter-connect fabric and SDN in the cloud to meet the needs of AI workloads [details] |
Panel
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Moderator: Peter Olcott, Principal at First Spark Ventures New business models in LLM workloads are reshaping the interconnect landscape. While ongoing challenges such as low latency, high bandwidth, and reliability persist, the emergence of scale-up networking creates new opportunities for performance with orders of magnitude more bandwidth... [details] |
Invited Talk
 Torsten Hoefler Professor at ETH Zürich Ultra Ethernet for next-generation AI and HPC workloads [details] |
Last Year’s Proceedings (HotI31 (2024))
Available at IEEE here.
Last Year’s Publications (HotI31 (2024))
Available at IEEE Micro.