2026-d3-0800-tutorial-track-2-open-interconnect-innovations-a-deep-dive-into

Archived conversation · Aug 13, 2026 8:44 PM – Aug 21, 2026 6:36 PM · 41 messages
Thursday, August 13, 2026

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Ryan Scherbarth (nvidia) renamed the channel from "2026-d2-0800-open-interconnect-innovations-a-deep-dive-into-the-aulink" to "2026-d3-0800-tutorial-open-interconnect-innovations-a-deep-dive-into-the-ualink"
Ryan Scherbarth (nvidia) renamed the channel from "2026-d3-0800-tutorial-open-interconnect-innovations-a-deep-dive-into-the-ualink" to "2026-d3-0800-tutorial-track-2-open-interconnect-innovations-a-deep-dive-into"
Friday, August 21, 2026

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peter.onufryk 9:54 AM
Hi
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swadesh.choudhary 9:54 AM
hi
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gerald.pasdast 9:55 AM
hi
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Chris Browning (Black Semi) 10:04 AM
Do we know if we will be able to get the slides from the tutorial?
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Sayan Ghosh 10:06 AM
We have requested slides from all the presenters and will make them available on the website on a rolling basis.
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Leila Rashidi 10:11 AM
Thanks for presentation. Is there any vendor to use UALink completely without using Ethernet in layer 2?
3 replies
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Leila Rashidi 10:26 AM
Thanks @Rob Pelt . Who will deploy it?
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Rob Pelt 10:26 AM
Sorry, I don't have knowledge of consortium members roadmaps.
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Hesham ElBakoury 10:16 AM
How to support RAS in chiplets?
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Leila Rashidi 10:25 AM
How UCIe 3.0 compares with Eliyanโ€™s NuLink?
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Chris Browning (Black Semi) 11:33 AM
Curious about how the compliance program works. Do you have a reference package, or a reference package design requirement that you must design to. Who is developing the golden die and is it possible to get them? What functionality does the golden die support.
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qingbow 12:20 PM
Do chiplets have to talk to chiplets on the other end? I got this impression from your diagram, but I believe I am wrong.
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Chris Browning (Black Semi) 12:22 PM
Will UALink transaction layer be added to the UCIe spec, or left as a vendor defined with it details in the UALink spec
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Benson Muite 12:24 PM
Will it be possible to build tools to assisting programmers in getting good performance out of chiplets? For example to know how to optimize data transfers?
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Chris Browning (Black Semi) 12:24 PM
Thanks for the compliance answer. I think that covers most of it. Is it possible to get the golden die design and arch information? Would the vendor purchase them and insert them into a package?
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Chris Browning (Black Semi) 12:27 PM
Thanks for the great presentation!!!
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Benson Muite 12:28 PM
Thanks for the nice presentation.
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Ryan Scherbarth (nvidia) 12:32 PM
@channel We will be going on break until the next session starting at 11:30 PT in the following channel: #C0BQ9G9ULHJ
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Leila Rashidi 6:36 PM
One question, any idea on impact of CPU racks on data center traffic?