In past year’s the best papers on interconnect microarchitecture have been invited to submit extended versions of their papers to special journal editions, we are pursuing this once again this year. Selected papers from last year’s Hot Interconnects are being published in the a special Hot Interconnects issue of IEEE Micro.

Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, data centers, and clouds. This yearly conference is attended by leaders in industry and academia. The atmosphere provides for a wealth of opportunities to interact with individuals at the forefront of this field.

Themes include cross-cutting issues spanning computer systems, networking technologies, and communication protocols for high-performance interconnection networks. This conference is directed particularly at new and exciting technology and product innovations in these areas.

Contributions should focus on real experimental systems, prototypes, or leading-edge products and their performance evaluation.

We invite paper submissions across a wide range of topics and levels, ranging from fundamentals to the latest advances in hot topic areas.

Topics of interest include, but are not limited to those listed at left.