2026 Conference Theme
Scale-Up, Scale-Out, Scale-Across: Do they really differ?
Call for Papers [details]
| Event | Deadline (AoE) |
|---|---|
| Paper abstract deadline | May 9, 2026 |
| Submission deadline | May 15, 2026 |
| Notification of acceptance | June 26, 2026 |
| Camera-ready due | July 17, 2026 |
HotI33 (2026) Overview
IEEE Hot Interconnects is the premier international forum for researchers and developers of state of the art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field.
Our objective is to address the data center networking and the supercomputing communities. We hope you can join us and benefit not only by the content but also by the prime networking opportunities this event always offers.
Keynotes
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| Gilad Shainer | Omar Baldonado | Bilal Riaz |
| Senior Vice President Marketing at NVIDIA | Vice Director of DC Networking at Meta | Senior Director of Product Line Management and Head of Interconnect Strategy, Ciena |
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TBD [details] |
TBD [details] |
TBD [details] |
Panel
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Moderator: Timothy Crawford, Managing Director at KeyBanc Capital Markets Abstract: TBD ... [details] |
Invited Talk
TBD
Last Year’s Proceedings (HotI32 (2025))
Available at IEEE here.
Watch the recordings of all sessions and talks on YouTube.
Last Year’s Publications (HotI32 (2025))
Available at IEEE Micro.