Welcome to the 33rd iteration of the IEEE Hot Interconnects symposium. HotI’2026 will be held virtually.

2026 Conference Theme
Scale-Up, Scale-Out, Scale-Across: Do they really differ?

Complex high-capacity training and disaggregated inference workloads are being scaled-across multiple sites, blurring the lines between contemporary scale-out and scale-up interconnection stacks. All the classical issues, such as jitter, bursts, flow/congestion, long-tail latencies, etc., are amplified over long distances, requiring deliberate interventions across the full interconnection stack: algorithms, operational tools, communication frameworks, and network fabrics. This edition of Hot Interconnects will explore these interventions behind operationalizing interconnects over long, short, and shorter distances.

Call for Papers [details]

Event	Date
Paper abstract deadline	TBD
Submission deadline	TBD
Notification of acceptance	TBD
Camera-ready due	TBD

HotI33 (2026) Overview

IEEE Hot Interconnects is the premier international forum for researchers and developers of state of the art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field.

Our objective is to address the data center networking and the supercomputing communities. We hope you can join us and benefit not only by the content but also by the prime networking opportunities this event always offers.

Keynotes

Gilad Shainer

Senior Vice President Marketing at NVIDIA [details]

Panel

Title: TBD Moderator: Timothy Crawford, Managing Director at KeyBanc Capital Markets Abstract: TBD ... [details]

Invited Talk

TBD

Last Year’s Proceedings (HotI32 (2025))

Available at IEEE here.

Watch the recordings of all sessions and talks on YouTube.

Last Year’s Publications (HotI32 (2025))

Available at IEEE Micro.