2025 Conference Theme - Interconnect Software: You can’t touch it but you need it

The latest advancements in photonics, chips, parallel paths, and other cutting-edge interconnect technologies are dazzling. However, the picture is incomplete without the system software needed to exploit their full potential. This edition of Hot Interconnects will explore the underlying software ecosystems that empower interconnect fabrics to support a wide array of applications.

To be added?

Topics of Interest

(but not limited to these)

  • Novel and innovative interconnect architectures
  • Accelerator interconnects, e.g. NVLINK, Infinity Fabric
  • System-on-Chip Interconnects
  • Network software/hardware designed for AI/ML workloads
  • Multi-core processor interconnects
  • System-on-Chip Interconnects
  • Chiplet-interconnect technologies such as UCIe and BOW
  • Advanced chip-to-chip communication technologies
  • Optical interconnects
  • Protocol and interfaces for inter-processor communication
  • Survivability and fault-tolerance of inter-connects
  • High-speed packet processing engines and network processors
  • Systems software for communication
  • System and storage area network architectures and protocols
  • High-performance host-network interface architectures
  • High-bandwidth and low-latency I/O
  • Pb/s switching and routing technologies
  • Innovative architectures for supporting collective communication
  • Novel communication architectures to support cloud & grid computing
  • Centralized and distributed cloud interconnects
  • Requirements driving high-performance interconnects
  • Traffic characterization for HPC systems and commercial data centers
  • Software-defined networking and software overlay networks
  • Software for network bring-up, configuration and performance management (OpenFlow, OpenSM)
  • Data Center Networking

Submissions

Event Date
Paper abstract deadline TBD
Submission deadline TBD
Notification of acceptance TBD

Process

This year we invite papers to be submitted either as regular, long papers (6-8 pages) or as hot topic papers (3-4 pages). Hot topic papers could be positional papers, industry papers, or papers describing hot-off-the-press breaking research results, and will be judged accordingly and independently from the regular long papers.

  • Papers need sufficient technical detail to judge quality and suitability for presentation. Submissions must conform to [IEEE ethics standards]
  • Submissions should include title, author, abstract, and paper in double-column, see [IEEE format] for details.
  • Regular/Long paper limit: 6-8 pages, single-spaced, 2 columns, excluding references.
  • Hot topic paper limit: 3-4 pages, single-spaced, 2 columns, including references.
  • Accepted papers (both long and hot topic papers) will be published in IEEE Xplore Digital Library. IEEE Micro?
  • Papers should be submitted electronically through EasyChair Link To be updated Submit Paper

We will be offering a best paper award this year.

Posters and Tutorials

We are also inviting tutorial submissions. More information regarding poster will come out soon.

Safety and Well-Being

Given the success of previous year’s online format, Hot Interconnects 2025 will continue to be an online conference.

Contact

To be added