Topics of Interest
- Systems software for communication
- Novel and innovative interconnect architectures
- Accelerator interconnects (e.g., NVLINK, Infinity Fabric)
- Network software/hardware for AI/ML workloads
- Multi-core processor interconnects
- System-on-Chip interconnects
- Chiplet-interconnect technologies (e.g., UCIe, BOW)
- Advanced chip-to-chip communication technologies
- Optical interconnects
- Protocols and interfaces for inter-processor communication
- Survivability and fault-tolerance of interconnects
- High-speed packet processing engines and network processors
- System and storage area network architectures and protocols
- High-performance host-network interface architectures
- High-bandwidth and low-latency I/O
- Pb/s switching and routing technologies
- Architectures for supporting collective communication
- Communication architectures for cloud & grid computing
- Centralized and distributed cloud interconnects
- Requirements driving high-performance interconnects
- Traffic characterization for HPC systems and data centers
- Software defined networking (SDN) and overlay networks
- Software for network bring-up, configuration, and performance management (e.g., OpenFlow, OpenSM)
- Data Center Networking
How to Submit
Propose tutorials for one half-day (three hours, 2 presenters max) duration. Submit proposals electronically to tutorials@hoti.org. Samples of visual aids are encouraged but not required (provide a URL if available).
Contact
For questions, contact: tutorials@hoti.org
Submissions and Schedule
| Event | Date |
|---|---|
| Proposals due | May 27, 2025 (Extension: June 3, 2025) |
| Notification of acceptance | June 3, 2025 (Extension: June 10, 2025) |
| Materials due | August 2, 2025 |
Submission Format
Submit a single PDF file with the following sections, each on a separate page:
- Title page:
- Title
- Name, organization, and email of each author
- 200-word abstract
- (Optional) URL with samples of visual aids
- Tutorial content description (1 page max):
- Goals and takeaways
- Relevance to HOTI 2025 attendees
- Target audience
- Content level: beginner, intermediate, or advanced
- Previous presentations and differences
- Detailed outline (2 pages max)
- Resume/CV for each presenter (2 presenters max, 1 page each)
- Statement agreeing to release notes to HOTI 2025 attendees
Review Process and Publication
Submissions will be reviewed by the Hot Interconnects 2025 tutorials committee based on relevance, interest, clarity, completeness, cohesiveness, and presenter experience. Materials must be submitted by May 27th and will be released to attendees. Submitters must agree to release the materials.
Safety and Well-Being
Hot Interconnects 2025 will continue as an online conference.