Hot Interconnects 2025 continues its tradition to offer world-class tutorials held by internationally renowned experts in the area of high-performance interconnect networks.

Scope

  • Novel and innovative interconnect architectures
  • Accelerator interconnects, e.g. NVLINK, Infinity Fabric
  • Network software/hardware designed for AI/ML workloads
  • Multi-core processor interconnects
  • System-on-Chip interconnects
  • Chiplet-interconnect technologies such as UCIe and BOW
  • Advanced chip-to-chip communication technologies
  • Optical interconnects
  • Protocol and interfaces for inter-processor communication
  • Survivability and fault-tolerance of interconnects
  • High-speed packet processing engines and network processors
  • Systems software for communication
  • System and storage area network architectures and protocols
  • High-performance host-network interface architectures
  • High-bandwidth and low-latency I/O
  • Pb/s switching and routing technologies
  • Innovative architectures for supporting collective communication
  • Novel communication architectures to support cloud & grid computing
  • Centralized and distributed cloud interconnects
  • Requirements driving high-performance interconnects
  • Traffic characterization for HPC systems and commercial data centers
  • Software defined networking (SDN) and software overlay networks
  • Software for network bring-up, configuration and performance management (e.g., OpenFlow, OpenSM)
  • Data Center Networking

Review Process and Publication

Tutorial submissions will be reviewed by the Hot Interconnects 2025 tutorials committee. The committee will consider, among other aspects, appropriateness and utility for the Hot Interconnects tutorial audience, timeliness and general interest, clarity, completeness, cohesiveness of the proposal and presentation history and teaching/speaking experience of the presenters.

All materials must be submitted to the tutorials chair by TBA and will be released to the attendees. Submitters must explicitly agree to release the materials for this purpose.

How to Submit

Tutorials may be proposed for one half-day (three hours, 2 presenters max) duration. Tutorials on new and emerging technologies are encouraged. Tutorial proposals must be submitted electronically to the submission address tutorials@hoti.org. Although not required, you are strongly urged to submit samples of your visual aids. You may supply a URL at which the samples may be found.

Submission

Attendees will come from mixed backgrounds and interests in interconnection networks. We encourage tutorials of broad applicability rather than those focusing solely on research in a limited domain or by a particular group. Areas of interest for tutorials include but are not limited to the list at left.

The submission should include a single PDF file with the following sections, each beginning on a separate page:

  • Title page including the following components:
    • Title
    • Name, organization, and email address of each author
    • 200-word (maximum) abstract
    • (Optional) A URL with samples of your visual aids
  • Description of the tutorial content (1 page maximum) containing:
    • Goals of the tutorials (takeaways for the audience)
    • Why is it relevant for HOTI 2025 attendees?
    • Target audience
    • Content level: beginner, intermediate, or advanced
    • Previous presentations of this tutorial including any differences in the proposed tutorial
  • Detailed outline of the tutorial (2 pages maximum)
  • Resume or curriculum vitae for each presenter (2 presenters maximum, 1 page maximum each)
  • A statement agreeing to release the notes to HOTI 2025 tutorial attendees

Important dates

  • Proposals due: TBA
  • Notification of acceptance: TBA
  • Materials due: TBA
  • Tutorial date: TBA

Safety and Well-Being

Given the success of previous year’s online format, Hot Interconnects 2025 will continue to be an online conference.

Tutorial Chairs

TBA