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Call For Tutorials

IEEE Hot Interconnects invites proposals for tutorials that expand on the 2026 conference theme of “Scale-Up, Scale-Out, Scale-Across: Do they really differ?” We seek half and full-day tutorials exploring the different interventions and technologies supporting data-center interconnects over long, short, and shorter distances. Tutorials will be held on the last day of the conference: Aug 21, 2026. We strongly encourage tutorial proposals to incorporate hands-on segments to engage the audience.

Submissions and Schedule

Call for Tutorials [details]

Event Date
Proposals due June 5, 2026
June 12, 2026
Notification of acceptance June 12, 2026
June 19, 2026
Materials due July 31, 2026
August 7, 2026

Topics of Interest

  • Network software/hardware for AI/ML workloads
  • Data Center Networking
  • Multi-core processor interconnects
  • Novel and innovative interconnect architectures
  • Optical interconnects
  • Accelerator interconnects
  • Fault-tolerance of interconnects
  • System-on-chip interconnects
  • Chiplet interconnect technologies
  • Software defined networking (SDN) and overlay networks
  • Traffic characterization
  • Network congestion management
  • System software for communication
  • High-bandwidth low-latency I/O
  • Communication architectures support AI/ML workloads

How to Submit

Submit your tutorial proposal through [EasyChair].

Contact

For questions, contact: tutorials@hoti.org