Call For Tutorials
IEEE Hot Interconnects invites proposals for tutorials that expand on the 2026 conference theme of “Scale-Up, Scale-Out, Scale-Across: Do they really differ?” We seek half and full-day tutorials exploring the different interventions and technologies supporting data-center interconnects over long, short, and shorter distances. Tutorials will be held on the last day of the conference: Aug 21, 2026. We strongly encourage tutorial proposals to incorporate hands-on segments to engage the audience.
Submissions and Schedule
| Event | Date |
|---|---|
| Proposals due | June 5, 2026 |
| Notification of acceptance | June 12, 2026 |
| Materials due | July 31, 2026 |
Topics of Interest
- Network software/hardware for AI/ML workloads
- Data Center Networking
- Multi-core processor interconnects
- Novel and innovative interconnect architectures
- Optical interconnects
- Accelerator interconnects
- Fault-tolerance of interconnects
- System-on-chip interconnects
- Chiplet interconnect technologies
- Software defined networking (SDN) and overlay networks
- Traffic characterization
- Network congestion management
- System software for communication
- High-bandwidth low-latency I/O
- Communication architectures support AI/ML workloads
How to Submit
Submit your tutorial proposal through [EasyChair].
Contact
For questions, contact: tutorials@hoti.org