Sponsor Talk

Dave Kulansky

Director of Product Management at Qualcomm

Title: Scaling AI with Chiplets & CPO

Abstract:

AI's explosive growth is straining datacenter connectivity across scale-up and scale-out networks, pushing optics ever closer to the compute. This talk traces that shift from pluggable modules to near-packaged optics (NPO) to co-packaged optics (CPO), showing how chiplet architectures and heterogeneous integration enable denser, lower-power optical I/O. We examine direct-drive versus digital-drive CPO, co-design, and weigh the opportunities and challenges shaping optical interconnects for upcoming generations.

Biography:

Dave Kulansky is a Director of Product Management at Qualcomm, where he leads product strategy and roadmap development for advanced connectivity and infrastructure technologies serving AI and datacenter markets. Working across engineering, architecture, and business teams, he helps define solutions that address the evolving needs of hyperscale and enterprise computing.

With 25+ years of semiconductor industry experience, Dave has held technical and product leadership roles spanning analog and mixed-signal (AMS) design, PCIe, Ethernet, and other high-speed interconnect technologies. He is passionate about translating complex technology into impactful products that accelerate innovation and enable the future of AI computing.

Dave holds a B.S.E. in Electrical Engineering from Princeton University and an M.S. in Electrical Engineering from Johns Hopkins University.