Welcome to the 31st iteration of the IEEE Hot Interconnects symposium. HotI’2024 will be held virtually.

IEEE Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field. Our objective is to address the data center networking and the supercomputing communities. We hope you can join us and benefit not only from the content but also from the prime networking opportunities this event always offers.

2024 Conference Theme – Can Interconnects Keep up with AI?

The explosion of AI and workloads related to machine learning and deep learning boggles the mind. Whether in massive data centers, edge locations, automobiles, or consumer appliances, AI stands to improve many tasks useful to people at work or at leisure. The demand for GPUs, DPUs, TPUs, and IPUs taxes the ability of their manufacturers to meet the market demand. Efficient utilization of these xPUs requires high speed and highly scalable interconnects. Whether between xPUs or between an xPU and memory, data transfer can easily become a bottleneck in computing efficiency. In this edition of IEEE Hot Interconnects, we explore advances in interconnection networks that alleviate this bottleneck. Solutions including optical circuit switching, dense photonic data paths, high-performance fabrics, and more will expand from the specialized applications of HPC to the pervasive applications of AI and in the process will become more affordable. This year’s HotI will thus be captivatingly relevant.

Thank you to our 2023 sponsors!

KEYNOTES

PANEL

Bandwidth Scaling for AI Interconnect

More wavelengths vs more fiber?

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