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Diamond Sponsor Talks

August 23, 2023 @ 10:00 am - 10:20 am UTC-7
  • Cornelis
    Speaker: Doug FullerTitle: Moving Omni-Path Forward

    Abstract: This presentation will reintroduce the Omni-Path Architecture (OPA) in its new home at Cornelis Networks. It will then detail how Cornelis Networks continues to develop OPA and what’s coming in the immediate future. Recent and future software innovations will be discussed along with the next generation of Omni-Path hardware. Cornelis Networks is a proud diamond-level sponsor of Hot Interconnects 2023.

    Bio: As Vice President of Software Engineering, Doug is responsible for all aspects of the Cornelis Networks software stack, including the Omni-Path Architecture drivers, messaging software, and embedded device control systems. Before joining Cornelis Networks, Doug led software engineering teams at Red Hat in cloud storage and data services. Doug’s career in HPC and cloud computing began at Ames National Laboratory’s Scalable Computing Laboratory. Following several roles in university research computing, Doug joined the US Department of Energy’s Oak Ridge National Laboratory in 2009, where he developed and integrated new technologies at the world-class Oak Ridge Leadership Computing Facility. Doug holds BS and MS degrees in Computer Science from Iowa State University.

  • Huawei
    Speaker: Davide ToniettoTitle: Energy Efficiency in Serial Links

    Abstract: The urgency of energy efficiencyin Data Centersis bringing to the forefront uncomfortablequestionsaboutindustry traditional responseto interconnect bandwidth increase. Can we keepdoubling data rate? Can we keep embedding very complex and inefficient long reach SerDesinside ASICs? Does it really pay off to go faster or it ispossibleto go more parallel? Is it moreefficient to remove re-timersin optical engines or it is more efficient to break electro-opticallinks up? To CPO or not to CPO?.

    Bio: Davide Tonietto is Huawei Fellow and Senior Director of Hisilicon Serial Link Team (HiLink)aglobal organizationwith teams in Canada and China.Since 2011 he is responsible for the SerDesIP technology roadmap definition, execution and integration within Hisiliconhigh performanceASICs.Over the past decade his organization provided SerDes for over 200 high performanceASICs utilized in a variety of Huawei products ranging from Networking, DC, HPC, Wirelessinfrastructure and Mobile applications. Davide received the Laurea Degree in Electrical Engineering from Pavia University, Italy in 1996.He has worked in several IC companies as analog IC designer and technical manager. He holdsmore than 20 US patents in the areas of Analog and Mixed Signal IC design and wirelinecommunication systems and authored several papers on the subjects. Hiscurrentresearchinterests are in the area ofserial linkenergy efficiencyoptimization,testing and reliability forboth copper and optical applications.