Electro-optical and die-to-die Interconnect Technologies in Datacenters: Significance, Advantages, and Future Implications

Title: Electro-optical and die-to-die Interconnect Technologies in Datacenters: Significance, Advantages, and Future Implications

Speaker: Priyank Shukla (Synopsys)

Abstract: This tutorial presents a comprehensive exploration of interconnect technologies in datacenters, aiming to provide attendees with a deep understanding of their significance and implications. It introduces interconnect technologies in datacenters such as Ethernet, CXL, PCIe, and InfiniBand, and provides insights into the motivations, advantages, and use cases of these technologies. The tutorial highlights the importance of emerging electro-optical interfaces, dieto-die interconnects and 800GbE/1.6TbE, in shaping the future of datacenters. This tutorial equips attendees with the knowledge and insights necessary to navigate the dynamic landscape of interconnect technologies in datacenters enabling them to make informed decisions regarding system-level power and performance trade-offs.

Bio: With over 15 years of experience in the semiconductor industry, Priyank Shukla is an ASIC IP Product Manager who has managed and driven complex product development cycles from concept to release. Currently, he serves as Sr. Staff Product Manager of Interface IPs at Synopsys Inc. In this role, he oversees a portfolio of products that includes 112G/224G high-speed SerDes, 400G/800G/1.6TbE Ethernet, and PCIe5-7. I am also an IEEE i802.3 Working Group Voter contributing to IEEE802.3dj/df task forces.